Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly

This study evaluates the impact of intermetallic compound (IMC) thickness on thermo-mechanical reliability lead-free SnAgCu solder joints in crystalline silicon solar cell assembly with regard to fatigue life. Finite element modelling is used simulate non-linear deformation joints. Five geometric models assemblies different IMC layers range 1 4 ?m are utilized. The were subjected accelerated thermal cycling from 40 °C 85 employing IEC 61215 standard for photovoltaic panels. Creep response each assembly's induced load simulated using Garofalo-Arrhenius creep model. Simulation results indicate that when grows incrementally 1, 2, 2.5, 3 and ?m, life diminishes 13,800, 11,800, 10,600, 9400 7800 cycles failure respectively. Thus, joint decreases as increases during service lifetime. Therefore, proper design must include consideration layer prevent premature ensure fulfilment desired functional lifetime 13,688 (25 years).